发布时间： 2020/4/16 15:05:11 | 878 次阅读
winbond华邦半导体的闪存（Code Storage Flash Memory）聚焦于中低容量产品，提供规格完整的串口式闪存（Serial Flash）和并行式闪存（Parallel Flash）产品，满足小尺寸封装规格，具有脚数低、体积小、成本低的特性；亦提供串口式 （SPI） NAND 型及单层式 （SLC） NAND 型闪存以满足客户更多的编码储存需求。winbond华邦代理商提供编码型闪存产品在计算机周边市场拥有相当的市占率，并且积极拓展应用于行动装置、消费电子，以及多样性之车用电子、物联网和穿戴装置等应用领域。
winbond华邦电子内存芯片型号：
| Part No. | Density | Voltage | Temp Range | Speed (MHz) | Package(s) |
| W25M512JV | 512Mb(64MB*8) | 2.7V-3.6V | -40°C to +85°C | 104 |
SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix) 24-ball TFBGA24 6X8mm (5x5 Matrix) |
| W25Q256JV | 256Mb(32MB*8) | 2.7V-3.6V | -40°C to +85°C | 104 |
SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix) 24-ball TFBGA24 6X8mm (5x5 Matrix) |
| W25Q256FV | 256Mb(32MB*8) | 2.7V-3.6V | -40°C to +85°C | 104 | |
| W25Q256JW | 256Mb(32MB*8) | 1.65-1.95V | -40°C to +85°C | 133 | |
| W25Q128BV | 128Mb(16MB*8) | 2.7V-3.6V | -40°C to +85°C | 104 |
SOIC8 208mil, SOIC16 300mil, WSON8 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil |
| W25Q128FV | 128Mb(16MB*8) | 2.7V-3.6V | -40°C to +85°C | 104 | |
| W25Q128JV | 128Mb(16MB*8) | 2.7V-3.6V | -40°C to +85°C | 133 | |
| W25Q128JW | 128Mb(16MB*8) | 1.65-1.95V | -40°C to +85°C | 104 | |
| W25Q128FW | 128Mb(16MB*8) | 1.65-1.95V | -40°C to +85°C | 104 | |
| W25Q64CV | 64Mb(8MB*8) | 2.7V-3.6V | -40°C to +85°C | 80 |
SOIC8 208mil, SOIC16 300mil, WSON8 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil |
| W25Q64FV | 64Mb(8MB*8) | 2.7V-3.6V | -40°C to +85°C | 104 | |
| W25Q64JV | 64Mb(8MB*8) | 2.7V-3.6V | -40°C to +85°C | 133 | |
| W25Q64FW | 64Mb(8MB*8) | 1.65-1.95V | -40°C to +85°C | 104 | |
| W25Q32BV | 32Mb(4MB*8) | 2.7V - 3.6V | -40°C to +85°C | 104 |
SOIC8 208mil, SOIC16 300mil, WSON8 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil |
| W25Q32FV | 32Mb(4MB*8) | 2.7V - 3.6V | -40°C to +85°C | 104 | |
| W25Q32JV | 32Mb(4MB*8) | 2.7V - 3.6V | -40°C to +85°C | 133 | |
| W25Q32FW | 32Mb(4MB*8) | 1.65V - 1.95V | -40°C to +85°C | 104 | |
| W25Q16DV | 16Mb(2MB*8) | 2.7V - 3.6V | -40°C to +85°C | 80/104 |
SOIC8 150mil, SOIC8 208mil, WSON8 6X5mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) , VSOP8 150mil, VSOP8 208mil, USON8 4x3mm |
| W25Q16JV | 16Mb(2MB*8) | 2.7V - 3.6V | -40°C to +85°C | 80/104 | |
| W25Q16CL | 16Mb(2MB*8) | 2.3V - 3.6V | -40°C to +85°C | 50/80 | |
| W25Q16JL | 16Mb(2MB*8) | 2.3V - 3.6V | -40°C to +85°C | 50/80 | |
| W25Q16DW | 16Mb(2MB*8) | 1.65V - 1.95V | -40°C to +85°C | 104 | |
| W25Q16FW | 16Mb(2MB*8) | 1.65V - 1.95V | -40°C to +85°C | 104 | |
| W25Q80DV | 8Mb(1MB*8) | 2.7V - 3.6V | -40°C to +85°C | 80/104 |
SOIC8 150mil, SOIC8 208mil, WSON8 6X5mm, VSOP8 150mil, USON8 2x3mm, USON8 4x3mm, WLCSP8 |
| W25Q80DL | 8Mb(1MB*8) | 2.3V - 3.6V | -40°C to +85°C | 80/104 | |
| W25Q80EW | 8Mb(1MB*8) | 1.65V - 1.95V | -40°C to +85°C | 104 | |
| W25X40CV | 4Mb(512KB*8) | 2.7V - 3.6V | -40°C to +85°C | 104 |
SOIC8 150mil, SOIC8 208mil, WSON8 6X5mm, VSOP8 150mil, USON8 2X3mm, USON8 4x3mm,WLCSP8 |
| W25Q40CV | 4Mb(512KB*8) | 2.7V - 3.6V | -40°C to +85°C | 104 | |
| W25X40CL | 4Mb(512KB*8) | 2.3V - 3.6V | -40°C to +85°C | 104 | |
| W25Q40CL | 4Mb(512KB*8) | 2.3V - 3.6V | -40°C to +85°C | 104 | |
| W25Q40EW | 4Mb(512KB*8) | 1.65V - 1.95V | -40°C to +85°C | 104 | |
| W25X20CV | 2Mb(256KB*8) | 2.7-3.6V | -40°C to +85°C | 80/104 |
SOIC8 150mil, WSON8 6X5mm, VSOP8 150mil, USON8 2X3mm, WLCSP8 |
| W25X20CL | 2Mb(256KB*8) | 2.3V - 3.6V | -40°C to +85°C | 50/104 | |
| W25Q20CL | 2Mb(256KB*8) | 2.3V - 3.6V | -40°C to +85°C | 50/104 | |
| W25Q20EW | 2Mb(256KB*8) | 1.65V - 1.95V | -40°C to +85°C | 104 | |
| W25X10CL | 1Mb(128KB*8) | 2.3V - 3.6V | -40°C to +85°C | 50/104 |
SOIC8 150mil, WSON8 6X5mm, VSOP8 150mil, USON8 2X3mm, WLCSP8 |
| W25Q10EW | 1Mb(128KB*8) | 2.3V - 3.6V | -40°C to +85°C | 104 | |
| W25X05CL | 512Kb(64KB*8) | 2.3V - 3.6V | -40°C to +85°C | 104 |
SOIC8 150mil, TSSOP8 173mil, USON 2x3mm |
